JPH0145949B2 - - Google Patents
Info
- Publication number
- JPH0145949B2 JPH0145949B2 JP59214366A JP21436684A JPH0145949B2 JP H0145949 B2 JPH0145949 B2 JP H0145949B2 JP 59214366 A JP59214366 A JP 59214366A JP 21436684 A JP21436684 A JP 21436684A JP H0145949 B2 JPH0145949 B2 JP H0145949B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact member
- connector according
- tip
- contact piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 10
- 239000013013 elastic material Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011295 pitch Substances 0.000 description 17
- 239000011888 foil Substances 0.000 description 14
- 238000000465 moulding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59214366A JPS6193565A (ja) | 1984-10-15 | 1984-10-15 | コネクタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59214366A JPS6193565A (ja) | 1984-10-15 | 1984-10-15 | コネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6193565A JPS6193565A (ja) | 1986-05-12 |
| JPH0145949B2 true JPH0145949B2 (en]) | 1989-10-05 |
Family
ID=16654595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59214366A Granted JPS6193565A (ja) | 1984-10-15 | 1984-10-15 | コネクタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6193565A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2529838Y2 (ja) * | 1990-05-28 | 1997-03-19 | 住友電装株式会社 | 圧接端子用コネクタハウジング |
| JP7089702B2 (ja) * | 2018-11-22 | 2022-06-23 | 株式会社オートネットワーク技術研究所 | 端子台および電線配索ユニット |
| WO2020105537A1 (ja) * | 2018-11-22 | 2020-05-28 | 株式会社オートネットワーク技術研究所 | 端子台および電線配索ユニット |
-
1984
- 1984-10-15 JP JP59214366A patent/JPS6193565A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6193565A (ja) | 1986-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |